Features of Mini384/640 LWIR Micro Thermal Camera Module
Extreme compactness, extremely low power consumption, and extremely light weight
a) Size advantages benefiting from ASIC and WLP package;
b) Low power consumption benefiting from the ASIC;
c) Mini series infrared module has only one circuit board, which is extremely light.
Self-developed Core Chip
a) The core processor adopts InfiSense self-developed ASIC infrared processing chip, which is only 1/6 of the size and 1/3 of the power consumption compared with traditional FPGA, with a competitive price;
b) With a self-developed WLP detector, it features a smaller size and lighter weight.
c) Equipped with industry-leading thermal image processing algorithm and temperature measurement algorithm, it can provide high-quality image and high-accuracy temperature measurement function.
Rich and Flexible Interfaces, Easy to Integrate
a) The module supports DVP parallel digital video output, SPI video transmission, and I2C and UART communication interface;
b) The module supports digital video formats such as RAW14, YUV, Y8, BT.656, BT.656, and LVCMOS;
c) The module supports simultaneous output of image data + temperature data;
d) The module integrates MCU internally and provides SDK for secondary development.
Specifications of Mini384/640 LWIR Micro Thermal Camera Module
Component Model | Mini384 | Mini384T | Mini640 | Mini640T |
Detector | WLP packaged uncooled VOx infrared focal plane detector |
Pixel Size | 12μm |
Spectral Band | 8~14μm |
Resolution | 384×288 | 640×512 |
Detector Frame Rate | 50Hz/25Hz |
NETD | ≤50Hz@25°C, F#1.0 (≤40mK, optional) |
Image Adjustment |
Brightness Adjustment | 0~255, optional |
Contrast Adjustment | 0~255, optional |
Polarity | Black-hot/White-hot |
Palettes | Supported |
Reticle | Display/Blank/Move |
Digital Zoom | 0.25×~2.0× continuous zoom |
Mirroring | Horizontal/Vertical/Diagonal |
Image Processing | TEC-less algorithm |
Non-uniformity correction |
Digital filter noise reduction |
Digital detail enhancement |
Module Power Supply |
Service Voltage | 1.8V, 3.3V, 5V |
Typical Power Consumption @ 25ºC | <0.55W | <0.60W |
Module Interface |
Digital Video | DVP |
Communication Interface | I2C/UART |
Physical Characteristics of Module (without lens) |
Weight | <10g |
Dimensions | 21mm×21mm |
Module Interface (module + expansion board) |
Service Voltage | 5~12V |
Power Protection | Support overvoltage, undervoltage, and reverse connection protection |
Video Output Interface | PAL or NTSC, BT.656, LVCMOS |
Support simultaneous output of all-array image + temperature data |
Communication Interface | I2C/RS232/UART |
Button | Four buttons |
Temperature Measurement |
Measurement Range | Not supported | High gain: -20°C~+150°C | Not supported | High gain: -20°C~+150°C |
Low gain: -20°C~+450°C | Low gain: -20°C~+450°C |
Measurement Accuracy | Not supported | High gain: ±3 | Not supported | High gain: ±3°C |
Low gain: ±5°C or ±3% of reading (The greater shall prevail) | Low gain: ±5°C or ±3% of reading (The greater shall prevail) |
Measurement Tool | Not supported | Point, line, and box analysis | Not supported | Point, line, and box analysis |
Adaptive Lens |
Athermalized Prime Lens | F#1.1: 9.1mm/13mm/18mm |
F#1.0: 19mm |
Environment Adaptability |
Operating Temperature | -40°C~+80°C |
Storage Temperature | -45°C~+85°C |
Humidity | 5%~95%, non-condensing |
Vibration | 6.06g, random vibration, all axes |
Impact | 80g, 4ms, final peak sawtooth wave, three axes, and six directions |
